Nanohardness and Residual Stress in TiN Coatings
Hernández, Luis Carlos y Ponce, Luis y Fundora, Abel y López, Enrique y Pérez, Eduardo (2011) Nanohardness and Residual Stress in TiN Coatings. Materials, 4 (5). pp. 929-940. ISSN 1996-1944
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Resumen
TiN films were prepared by the Cathodic arc evaporation deposition method under different negative substrate bias. AFM image analyses show that the growth mode of biased coatings changes from 3D island to lateral when the negative bias potential is increased. Nanohardness of the thin films was measured by nanoindentation, and residual stress was determined using Grazing incidence X ray diffraction. The maximum value of residual stress is reached at −100 V substrate bias coinciding with the biggest values of adhesion and nanohardness. Nanoindentation measurement proves that the force-depth curve shifts due to residual stress. The experimental results demonstrate that nanohardness is seriously affected by the residual stress.
Tipo de elemento: | Article | ||||||||||||||||||
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Palabras claves no controlados: | negative substrate bias potential; residual stress; nanohardness; nanoindentation | ||||||||||||||||||
Divisiones: | Centro de Innovación, Investigación y Desarrollo en Ingeniería y Tecnología | ||||||||||||||||||
Usuario depositante: | Lic. Josimar Pulido | ||||||||||||||||||
Creadores: |
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Fecha del depósito: | 29 Abr 2019 18:44 | ||||||||||||||||||
Última modificación: | 29 Abr 2019 18:44 | ||||||||||||||||||
URI: | http://eprints.uanl.mx/id/eprint/15078 |
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